Reflection based Strain Sensing using Metamaterials
DOI:
https://doi.org/10.21935/tls.v3i1.125Abstract
Resonator arrays of periodicially arranged electromagnetic sub-wavelength resonators show a strong frequency filter behaviour which can be controlled by the geometry, size and arrangement of the resonators. The use of several resonator arrays and their integration into a polymer matrix allows the realisation of metamaterials with a specific resonance behaviour. The resonance behaviour can be influenced by material and structural changes enabling a passive sensor function. The considered sensor approach based on metamaterials is investigated to enable structural health monitoring of lightweight structures. In the present case, a double-layer Jerusalem cross (JC) resonator array (RA) is integrated into a glass fibre reinforced plastic (GFRP) to analyse the change of the resonance behaviour under load (strain) using a reflection measurement. The CST (Computer Simulation Technology) Microwave Studio was used to model the resonator array for operation in the microwave frequency range between 15 GHz and 35 GHz as well as for the numerical analysis of the resonance behaviour under load. The numerical results were validated by a tensile test using a tensile test machine (type TIRATEST 28100, Tira GmbH) and by a reflection measurement using two standard gain horn antennas (type Standard Gain Horn Series 862, ARRA Inc) and a vector network analyser (type ZVA50, Rohde&Schwarz). The reflection measurement shows a reflection minimum at 28.6 GHz which moves to higher frequencies under load of the GFRP laminate. With the shift of the minimum, the quality factor decreases and the dip widens. The investigation shows that it is possible to provide a GFRP laminate with a specific electromagnetic behaviour by integrating resonator arrays. It is also shown that the specific electromagnetic behaviour can be influenced by structural changes and thus opens up the possibility of monitoring the condition of lightweight structures.
Downloads
Published
Issue
Section
License
Authors who publish with Technologies for Lightweight Structures (TLS) agree to the following terms:
-
The corresponding authors confirm with their imprimatur that the article’s publication in Technologies for Lightweight Structures and the copyright terms have been approved by all the other coauthors.
-
Authors retain copyright and grant Technologies for Lightweight Structures the right of first publication.
-
If the paper is accepted for publication the content is licenced under a Creative Commons Licence “Attribution 4.0 International (CC BY 4.0)”. This permits use, distribution, and reproduction in any medium, provided the original work is properly cited, and is otherwise in compliance with the licence. Alternative Creative Commons Licences may be assigned in duly justified cases after consultation with the publisher (mail to: tls-journal@tu-chemnitz.de).
-
Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., publish it in a book), with an acknowledgement of its initial publication in Technologies for Lightweight Structures.
-
Authors are permitted and encouraged to post the peer-reviewed, pre-copyedited version (post-print) of their articles online (e.g., in institutional repositories or on their website) prior to and during the submission process as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access). If authors wish to republish an article, they are kindly asked to include the following acknowledgment as well as a link to the original source of publication in Technologies for Lightweight Structures to secure consistent citations:
This is a peer-reviewed, pre-copyedited version of an article accepted for publication in the open access journal Technologies for Lightweight Structures (TLS). The original publication with full bibliographic citation is available online at: xxx [insert DOI received upon publication].
For further questions, feel free to contact us via e-mail.