Technologies for the integration of miniaturised silicon sensor systems in fibre-reinforced composites

  • Benjamin Arnold Department of Microsystems and Biomedical Engineering, Chemnitz University of Technology
  • Ricardo Decker Department of Lightweight Structures and Polymer Technology, Chemnitz University of Technology
  • Florian Rost Fraunhofer Institute for Electronic Nano Systems ENAS
  • Angelika Bauer Department of Lightweight Structures and Polymer Technology, Chemnitz University of Technology
  • Jan Mehner Department of Microsystems and Biomedical Engineering, Chemnitz University of Technology
  • Lothar Kroll Department of Lightweight Structures and Polymer Technology, Chemnitz University of Technology
  • Sven Rzepka Fraunhofer Institute for Electronic Nano Systems ENAS
  • Thomas Otto Fraunhofer Institute for Electronic Nano Systems ENAS

Abstract

Functional integration processes gain more and more importance in lightweight engineering. In this paper we discuss how to improve fibre-reinforced composites with structurally integrated condition monitoring systems, suitable for predicting failure behaviour. Especially commercially available and tested silicon sensors, but also new developments are well-suited for this intention. We present a smart semi-finished textile with integrated silicon sensors for in-situ conditions and process monitoring in fibre-reinforced composites. It consists of a textile substrate tape with integrated electrically conductive fibres and various silicon sensors, applied by micro-injection moulding. A so-called “interposer” is used as an electrical adapter between the microstructures of the sensor system and the mesostructures of the textile. The key technology used for the encapsulation and electrical contacting of the sensor nodes is a two-stage two-component micro injection moulding process, allowing for a cost efficient and application specific mass production. As proof of concept we chose the injection moulding process to investigate the influence of the fabrication process on all electronic components with a silicon stress measurement chip. We performed in-situ measurements of temperature and in-plane mechanical stress for different glass fibre contents of the PA6 melt and tool temperatures and compared the results with a finite element simulation.
Published
2019-01-09